濺鍍靶材,Sputtering Targets

提供行業:裝飾鍍膜,工具鍍膜,機殼鍍膜, 燃料電池液晶面板,觸控面板,太陽能電池矽晶圓背面金屬化,半導體前後段製程發光二極體,有機發光二極體, 電阻元件靶材

提供學術及研發單位研究開發靶材
材質依英文字母序分為:

M
Magnesium (Mg) Sputtering Targets	Magnesium Fluoride (MgF2) Sputtering Targets	Magnesium Oxide (MgO) Sputtering Targets
Manganese (Mn) Sputtering Targets	Manganese Oxide (MnO) Sputtering Targets	Molybdenum Carbide (Mo2C) Sputtering Targets
Molybdenum Disilicide (MoSi2) Sputtering Targets	Molybdenum (Mo) Sputtering Targets	Molybdenum Disulfide (MoS2) Sputtering Targets
Molybdenum Oxide (MoO3) Sputtering Targets
N
Neodymium (Nd) Sputtering Targets	Nickel (Ni) Sputtering Targets	Nickel Chromium (NiCr) Sputtering Targets
Nickel Iron (NiFe) Sputtering Targets	Nickel Oxide (NiO) Sputtering Targets	Niobium (Nb) Sputtering Targets
Niobium Carbide (NbC) Sputtering Targets	Niobium Nitride (NbN) Sputtering Targets	Niobium Oxide (Nb2O5) Sputtering Targets
P
Palladium (Pd) Sputtering Targets	Permalloy (NiFeMoMn) Sputtering Targets	Platinum (Pt) Sputtering Targets
Praseodymium (Pr) Sputtering Targets	Rhenium (Re) Sputtering Targets	Rhodium (Rh) Sputtering Targets

第◊ AB◊ CDE◊ GHIL ◊ MNP ◊ RST ◊ WVYZ ◊ 頁