濺鍍靶材,Sputtering Targets

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濺鍍靶材,Sputtering Targets

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提供行業:裝飾鍍膜,工具鍍膜,機殼鍍膜, 燃料電池 液晶面板,觸控面板,太陽能電池 矽晶圓背面金屬化,半導體前後段製程 發光二極體,有機發光二極體, 電阻元件靶材

提供學術及研發單位研究開發靶材
材質依英文字母序分為:
A
Aluminum (Al) Sputtering Targets Aluminum Nitride (AlN) Sputtering Targets Aluminum Oxide (Al2O3) Sputtering Targets
Antimony (Sb) Sputtering Targets Antimony Telluride (Sb2Te3) Sputtering Targets  
B
Barium (Ba) Sputtering Targets Barium Fluoride (BaF2) Sputtering Targets Barium Titanate (BaTiO3) Sputtering Targets
Bismuth (Bi) Sputtering Targets Bismuth Oxide (Bi2O3) Sputtering Targets Bismuth Selenide (Bi2Se3) Sputtering Targets
Bismuth Telluride (Bi2Te3) Sputtering Targets Boron (B) Sputtering Targets Boron Carbide (B4C) Sputtering Targets
Boron Nitride (BN) Sputtering Targets    
第◊ AB◊ CDE◊ GHIL ◊ MNP ◊ RST ◊ WVYZ ◊ 頁

│High Purity Materials 高純度材料│

│Special Metals Alloys 特殊金屬合金 │

│ Powder / Nano Materials 粉末及奈米材料│

│Special Ceramic Materials 特殊陶瓷材料│