靶材背板,Target Backing Plate

為了避免濺鍍靶材(Sputtering Targets)於使用中破裂, 需要將(濺鍍靶材Sputtering Targets)焊接合(Bonding)在背板(Backing Plate)上, 故對於背板(Backing Plate)的選擇也因濺鍍靶材(Sputtering Targets)的冷卻及電接觸性能,熱膨脹差異,熱傳導率,也會有不同的材質選擇.

靶材背板形狀:Planar (Plate ) Backing Plate 平板, Disk, Circular Backing Plate 圓形板, Rotable Tublar Backing Plate 旋轉管.

Copper 101 紅銅 Copper(OFHC)無氧銅 濺鍍靶材(Sputtering Targets)背板(Backing Plate)

Stainless Steel 不銹鋼 濺鍍靶材(Sputtering Targets) 背板(Backing Plate)

Aluminum alloy 鋁合金 濺鍍靶材(Sputtering Targets) 背板(Backing Plate)

Molybdenum,鉬 濺鍍靶材(Sputtering Targets)背板(Backing Plate)

Titanium,鈦 濺鍍靶材(Sputtering Targets)背板(Backing Plate)

Invar 因瓦鐵鎳合金 濺鍍靶材(Sputtering Targets) 背板(Backing Plate)

Kovar, 科瓦鐵鎳鈷合金 濺鍍靶材(Sputtering Targets)背板(Backing Plate)

Copper Chrome alloy 鉻銅合金 濺鍍靶材(Sputtering Targets) 背板(Backing Plate)

│High Purity Materials 高純度材料│