Molybdenum_Mo_鉬_靶材背板_Target_Backing_Plate

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Molybdenum 鉬_濺鍍靶材(Sputtering Targets)背板(Backing Plate)

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靶材背板材質:Copper 101, Copper (OFHC), Stainless Steel, Aluminum alloy, Molybdenum, Titanium, Invar, Kovar, Copper Chrome alloy

靶材背板形狀:Planar (Plate ) Backing Plate 平板, Disk, Circular Backing Plate 圓形板, Rotable Tublar Backing Plate 旋轉管.

濺鍍靶材(Sputtering Targets)背板(Backing Plate)
Copper 101 紅銅 Copper(OFHC)無氧銅
濺鍍靶材(Sputtering Targets)背板(Backing Plate)
Stainless Steel 不銹鋼
濺鍍靶材(Sputtering Targets) 背板(Backing Plate)
Aluminum alloy 鋁合金
濺鍍靶材(Sputtering Targets) 背板(Backing Plate)
Molybdenum 鉬
濺鍍靶材(Sputtering Targets)背板(Backing Plate)
Titanium,鈦
濺鍍靶材(Sputtering Targets)背板(Backing Plate)
Invar 因瓦鐵鎳合金
濺鍍靶材(Sputtering Targets) 背板(Backing Plate)
Kovar, 科瓦鐵鎳鈷合金
濺鍍靶材(Sputtering Targets)背板(Backing Plate)
Copper Chrome alloy 鉻銅合金
濺鍍靶材(Sputtering Targets) 背板(Backing Plate)

│High Purity Materials 高純度材料│

│Special Metals Alloys 特殊金屬合金 │

│ Powder / Nano Materials 粉末及奈米材料│

│Special Ceramic Materials 特殊陶瓷材料│