蒸鍍,濺鍍,真空鍍膜物質使用對照表,PVD Table

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蒸鍍,濺鍍,真空鍍膜物質使用對照表 PVD Table

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物理氣相沉積法(Physical Vapor Deposition)

分為:濺鍍(Sputtering)及蒸鍍(Evaporation)是在高真空狀況下，利用電阻或電子束加熱,將所要蒸鍍的材料,以達到熔化溫度，使之熔解並氣化，氣態之薄膜材料之原子或分子因同時具有加溫後的動能附著在基板表面上的鍍膜技術。熱電阻式蒸鍍及電子束蒸鍍為常見之兩種方式:

15. Lithium Chloride LiCl,Lithium Fluoride LiF,Lithium Iodide LiI,Lithium Niobate LiNbO3,Lithium Oxide Li2O,Lutetium Lu,Lutetium Oxide Lu2O3,Magnesium Mg,Magnesium Aluminate MgAl2O4,Magnesium Bromide MgBr2,Magnesium Chloride MgCl2,Magnesium Fluoride MgF2, More Detail

16. Magnesium Iodide MgI2,Magnesium Oxide MgO,Manganese Mn,Manganese (II) Oxide MnO,Manganese (III) Oxide Mn2O3,Manganese (IV) Oxide MnO2,Manganese Bromide MnBr2,Manganese Chloride MnCl2,Manganese Sulfide MnS,Mercury Hg,Mercury Sulfide HgS,Molybdenum Mo, More Detail

17. Molybdenum Boride MoB2,Molybdenum Carbide Mo2C,Molybdenum Sulfide MoS2,Molybdenum Oxide MoO3,Molybdenum Silicide MoSi2,Neodymium Nd,Neodymium Fluoride NdF3,Neodymium Oxide Nd2O3,Nichrome IV® † Ni/Cr,Nickel † Ni,Nickel Bromide NiBr2,Nickel Chloride NiCl2, More Detail

18. Nickel Oxide NiO,Nickel/Iron † Ni/Fe,Nimendium † Ni3%Mn,Niobium Nb,Niobium (II) Oxide NbO,Niobium (III) Oxide Nb2O3,Niobium (V) Oxide Nb2O5,Niobium Boride NbB2,Niobium Carbide NbC,Niobium Nitride NbN,Niobium Telluride NbTe2,Niobium-Tin Nb3Sn, More Detail

19. Osmium Os,Osmium Oxide Os2O3,Palladium Pd,Palladium Oxide PdO,Parylene C8H8,Permalloy® † Ni/Fe/Mo/Mn,Phosphorus P,Phosphorus Nitride P3N5,Platinum Pt,Platinum Oxide PtO2,Plutonium Pu,Polonium Po, More Detail

20. Potassium K,Potassium Bromide KBr,Potassium Chloride KCl,Potassium Fluoride KF,Potassium Hydroxide KOH,Potassium Iodide KI,Praseodymium Pr,Praseodymium Oxide Pr2O3,PTFE PTFE,Radium Ra,Rhenium Re,Rhenium Oxide ReO3, More Detail

21. Rhodium Rh,Rubidium Rb,Rubidium Chloride RbCl,Rubidium Iodide RbI,Ruthenium Ru,Samarium Sm,Samarium Oxide Sm2O3,Samarium Sulfide Sm2S3,Scandium Sc,Scandium Oxide Sc2O3,Selenium Se,Silicon Si, More Detail

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