Glass_Wafers and Substrates_玻璃基板:

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Glass_Wafers and Substrates_玻璃基板:

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新輔科技, Nutek Material,長期提供之晶體,晶圓片,基板,Crystals,Wafers,Substrates:

矽(Si)晶圓片,Sapphire Wafer,Al2O3,藍寶石晶圓片,Glass_Wafers and Substrates_玻璃基板,II-VI Group Wafer, 二六族化合物晶圓片,Glass / Ceramic Substrates,玻璃及陶瓷基板,Quartz,SiO2/SiC/SrTiO3 Wafer,石英/碳化矽/氧化鍶鈦晶圓片, Germanium /MgO Wafer,鍺 Ge/氧化鎂 晶片,Single Crystal Substrates,單晶基板
Glass_Wafers and Substrates_玻璃基板

Glass_Wafers and Substrates_玻璃基板

Glass Type Substrate Size Wafer Diameter Thickness Flat TTV. Surface/ Roughness
B270 5x 5 mm 1 inch. 0.5mm SEMI.Standard
without flats 		TTV.< 20um SSP/DSP
Ra<10A.
Borofloat 10 x 10 mm 2 inch. 0.6 mm SEMI.Standard
without flats 		TTV.< 20um SSP/DSP
Ra<15A.
Soda Lime Glass 20 x 20 mm 3 inch. 0.7 mm SEMI.Standard
without flats 		TTV.< 15um SSP/DSP
Ra<12A.
Fused Silica 50 x 50 mm 4 inch. 1.0 mm SEMI.Standard
without flats 		TTV.< 20um SSP/DSP
Ra<15A.
Corning 1737 100 x 100 mm 5 inch. 1.1 mm SEMI.Standard
without flats 		TTV.< 20um SSP/DSP
Ra<15A.
ITO Glass Wafer 6 inch. SEMI.Standard
without flats 		TTV.< 20um SSP/DSP
Ra<15A.
Pyrex 7740® 8 inch. SEMI.Standard
without flats 		TTV.< 20um SSP/DSP
Ra<10A.
BK-7 other/all
size available		 other/all
size available		 SEMI.Standard
without flats 		TTV.< 15um SSP/DSP
Ra<10A.
D263T SEMI.Standard
without flats 		TTV.< 15um SSP/DSP
Ra<10A.
Eagle XG SEMI.Standard
without flats 		TTV.< 20um SSP/DSP
Ra<15A.

│High Purity Materials 高純度材料│

│Special Metals Alloys 特殊金屬合金 │

│ Powder / Nano Materials 粉末及奈米材料│

│Special Ceramic Materials 特殊陶瓷材料│